产品简介:优化系列X2认证型,采用高分子聚丙烯薄膜介质、加厚型金属化电极、全自动喷焊工艺,94V0级阻燃PBT塑壳、耐湿热环氧树脂密封、CP线引出。高耐压、耐湿热、低容降,**于阻容降压电路,如LED驱动模块、电表、小家电等低功率电子消费产品。 安规电容器 优化系列X2认证型,采用高分子聚丙烯薄膜介质、加厚型金属化电极、全自动喷焊工艺,94V0级阻燃 PBT塑壳、耐湿热环氧树脂密封、CP线引出。高耐压、耐湿热、低容降,**于阻容降压电路,如LED 驱动模块、电表、小家电等低功率电子消费产品。 认证标志 Safety approvals UL&CUL、VDE&ENEC、CQC、KC 执行标准 Implemented standard GB/T14472-1998,UL60384-14,IEC60384-14 气候类别 Climatic category 40/105/21(VDE,ENEC, CQC); 40/110/56/B (UL&CUL) 认证类别 Subclass X2 额定电压 Rated voltage 250/275/310VAC (50/60Hz) 容量范围 Capacitance range 0.22μF~3.3μF 容量偏差 Capacitance tolerance ±5%(J)、±10%(K) 耐电压 Voltage proof 较间between terminals 4.3*UR(VDC)/10s 较壳between terminals and case 2*UR+1500(VAC)/ 60s (2000VAC min) 绝缘电阻 Insulation resistance (20℃) 较间 between terminals ≥15000MΩ, CR≤0.33μF (100Vdc,60s) ≥5000S , CR >0.33μF (100Vdc,60s) 较壳between terminals and case ≥30000MΩ (100Vdc,60s) 损耗角正切 Tangent of loss angle (20℃) CR≤1μF ≤0.001(1KHz); ≤0.003(10KHz) CR>1μF ≤0.002(1KHz) 电压爬升率 Pulse rise time(dv/dt) 100V/μs Max 常用规格(Dimension) unit:mm Rated Cap. L W H P Фd Rated Cap. L W H P Фd 0.22μF 18.0 8.5 14.5 15.0 0.8 0.47μF 31.0 9.0 18.0 27.5 0.8 0.33μF 18.0 10.0 15.8 15.0 0.8 0.68μF 31.5 10.8 19.5 27.5 0.8 0.47μF 18.0 11.2 19.2 15.0 0.8 1.0μF 31.5 10.8 19.5 27.5 0.8 0.22μF 26.3 7.0 16.5 22.5 0.8 1.0μF 31.5 13.0 21.6 27.5 0.8 0.33μF 26.3 8.5 17.0 22.5 0.8 1.2μF 31.5 13.0 21.6 27.5 0.8 0.47μF 26.3 10.0 19.0 22.5 0.8 1.5μF 31.5 14.0 25.0 27.5 0.8 0.68μF 26.3 10.0 19.0 22.5 0.8 1.8μF 32.0 16.0 25.5 27.5 0.8 0.82μF 26.3 11.0 20.0 22.5 0.8 2.0μF 32.0 15.0 30.0 27.5 0.8 1.0μF 26.3 13.0 23.0 22.5 0.8 2.2μF 32.0 15.0 30.0 27.5 0.8